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    Probe Card 제조 전문기업

  • 아이에스 테크놀로지

    The Best Total Solution Provider

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    High-Quality & Customizing Service

사업영역Business Area

DDI / Film Test

Probes(MAX) : ND3 Over 3,000pin / Min. pad pitch : 18㎛ / Min. pad : 12 x 55㎛ / PCB size : ND3 ~350mm

Logic / SoC

Probes(MAX) : Over 2,500pin / Min. pad pitch : 40㎛ / Min. pad : 35 x 35㎛ / PCB size : 300㎛

CIS

Probes(MAX) : Over 3,000pin / Min. pad pitch : 100㎛ / Min. pad : 50 x 70㎛ / PCB size : ~350mm

Smart IC

Probes(MAX) : 3,500pin / Min. pad pitch : 50㎛ / Min. pad : 45 x 45㎛ / PCB size : ~440㎛

Low Leakage

Probes(MAX) : 48 pin / Min. pad pitch : 30 ㎛ / Min. pad : 25㎛ x 25㎛ / PCB : HP4071/72, S600 Series

Vertical

Max Pin Count : 30,000 / Dut (Flip Chip BGA) : 1,2,4,6 / Min Pitch : 130㎛ / Diital Speed : 200Mhz

Power IC

Material : W,BeCu,P7,AgW / PARA : 16 / Max Voltage : 2400V / Max Current : 160A

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