아이에스 테크놀로지 Probe Card 제조 전문기업

    현재메뉴

    Cantilever Probe Card

    Probe card Specification

    Probe card Specification 목록
    Content Specification Content Specification
    Contact Force 0.4g ~ 0.8g/mil PARA 1~8 Para
    Material ReW,P7,PT, Pd Alloy Needle Diameter Ø70 ~ 200㎛
    Minimum Pad Pitch Staggered 13㎛ Test temperature -40℃ ~125℃
    Planarity ±4~5㎛ Tip Alignment ±2㎛
    Probe Depth Customer specified Tip Diameter 5~10±2㎛
    Leakage Less then 5nA Needle Type Shape, Radius

    Application 별 Probe Card 규격

    Application 별 Probe Card 규격목록
    Application DDI / F/T Logic / SoC F/T Smart IC CIS Low Leakage
    Probes(MAX) ND3:Over 3,000pin Over 2,500pin Over 3,500pin < 3,500pin < 3,000pin 48 PIN
    ND4:Over 6,000pin ND4:Over 6,000pin
    Min. pad pitch 18㎛ (in-line) 40㎛ 100㎛ < 50㎛ < 50㎛ 30㎛
    9㎛ (Staggered 4Layer) PYRAMIDTYPE(9F):110㎛ NORMAL(12F):120㎛
    Min. pad size 13 × 55㎛ 13 × 35㎛ 50 × 70㎛ 45 × 45㎛ 45 × 45㎛ 25 × 25㎛
    PCB size ND3: ~ Ø350mm < Ø300mm ~ Ø350mm < Ø440mm < Ø440mm < Ø230mm

    Total Solution (PCB Design & Probe Card)

    당사는 고객의 요구사항에 부합하는 최적의 제품을 경쟁력 있는 조건에 공급하도록 하겠습니다.

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